Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

Iddq testing is one of the many ways to test CMOS integrated circuits in production. These circuits are usually tested as a way to find different types of manufacturing faults. Electric faults can be ...

In an era where semiconductor technology drives innovation across industries, the importance of effective verification methods has never been more prominent. As designs become increasingly complex, ...

Looking for a QFN packaging company for prototype, low-volume or production assembly? AnySilicon helps semiconductor companies connect with IC packaging and assembly providers offering standard and ...

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) and Cypress Semiconductor Corporation (NASDAQ: CY) today announced that the companies have signed a definitive agreement under which Infineon will ...