Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

GlobalFoundries’ Singapore manufacturing operations are reportedly running at more than 90% capacity utilization as the foundry expands its silicon photonics footprint to meet rising demand from ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...

September 03, 2026 − Chiplet architectures enable complex systems to be built by combining multiple dies within a single package. For this approach, standardized die-to-die communication is essential.