GlobalFoundries and TSMC have signed a $2 billion manufacturing agreement that will establish a U.S.-based source of silicon interposers for TSMC’s CoWoS advan ...

Semiconductor intellectual property provider CAST today announced that Guangzhou Zhiyuan Electronics Co., Ltd. (ZLG) has ...

Advanced packaging has become the place where AI system performance is won or lost. High-end performance packaging revenue is ...

For semiconductor products entering production today, silicon remains the strongest choice when maximum routing density, ...

That has made chiplets, HBM, silicon interposers, redistribution layers, bridges and 3D stacking increasingly important.

What Is a QFN Package? QFN stands for Quad Flat No-Lead. It belongs to the broader family of bottom-termination components (BTCs). Instead of using leads that extend outside the package, the ...

Synopsys (Nasdaq: SNPS) and OpenAI today announced a strategic partnership that brings together OpenAI’s advanced AI ...

The semiconductor industry’s AI investment cycle has largely been associated with advanced logic, HBM memory and increasingly ...

September 03, 2026 − Chiplet architectures enable complex systems to be built by combining multiple dies within a single ...

Finding experienced analog and mixed-signal IC designers can be difficult, especially when your project requires proven ...

Semiconductor Manufacturing International Corporation (SMIC) delivered a strong second quarter of 2026, with quarterly revenue surpassing $3 billion for the first time, supported by higher wafer ...

When a semiconductor device fails, the visible damage is not necessarily the root cause. A damaged metal line, cracked package, leaking transistor or burned bond wire may be the final result of a ...